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Terahertz topological photonics for on-chip communication
Yihao Yang, Yuichiro Yamagami, Xiongbin Yu, Prakash Pitchappa, Baile Zhang, Masayuki Fujita, Tadao Nagatsuma, Ranjan Singh
TL;DR
Integrated, low-cost THz interconnects are needed for on-chip data communication, while conventional approaches are sensitive to defects and lose power at sharp bends. The paper experimentally demonstrates robust THz topological valley transport on low-loss, all-silicon chips, with similar straight- and twisted-wall transmission within the gap and error-free communication up to 11 Gbit/s.
Problem
Integrated, low-cost, efficient on-chip THz interconnects remain needed, while conventional approaches are defect-sensitive and incur considerable losses at sharp bends.
Source: p. 2Method
The paper experimentally demonstrates robust THz topological valley transport on low-loss, all-silicon chips.
Source: p. 2Results
Transmission was similar for straight and twisted domain walls within the gap, and communication was error-free at up to 11 Gbit/s (BER < 10^-11).
Source: pp. 7–8Takeaways & Limitations
The demonstrated kink states serve as information carriers for high-speed THz communication through highly twisted domain walls.
Source: pp. 7–8The study focuses on transverse-electric-like modes.
Source: p. 3
Abstract
from arXiv · showhide
The computing speeds in modern multi-core processors and big data servers are no longer limited by the on-chip transistor density that doubles every two years following the Moores law, but are limited by the on-chip data communication between memories and microprocessor cores. Realization of integrated, low-cost, and efficient solutions for high speed, on-chip data communications require terahertz (THz) interconnect waveguides with tremendous significance in future THz technology including THz-wave integrated circuits and THz communication. However, conventional approaches to THz waveguiding suffer from sensitivity to defects and considerable bending losses at sharp bends. Here, building on the recently-discovered topological phase of light, we experimentally demonstrate robust THz topological valley transport on low-loss, all-silicon chips. We show that the valley polarized topological kink states exhibit unity transmission over a bulk band gap even after propagating through ten sharp corners. Such states are excellent information carriers due to their robustness, single-mode propagation, and linear dispersion-key properties for next generation THz communications. By leveraging the unique properties of kink states, we demonstrate error-free communication through a highly-twisted domain wall at an unprecedented data rate (10 Gbit/s) and uncompressed 4K high-definition video transmission. Our work provides the first experimental demonstration of the topological phases of THz wave, which could certainly inspire a plethora of research on different types of topological phases in two and three dimensions.
Author Information
The authors report no competing financial interests, welcome comments on the online manuscript, and direct correspondence and materials requests to Drs. Ranjan.
- The authors declare no competing financial interests, welcome comments on the online manuscript, and direct correspondence and materials requests to Drs. Ranjan.Source: Author Information · p. 12